Thermal issues in today's electronic designs have become significantly more challenging due to advanced nodes and heterogeneous integration, such as in 3D-ICs. Complete thermal analysis is required to predict performance due to an increase in power and shrinkage in area. In addition, large designs require high-capacity solutions to avoid partitioning the design into smaller pieces, since thermal is a global problem. The lack of a unified platform to evaluate the effectiveness of a thermal solution early in the design process and to avoid design respins is a critical problem. A shift-left strategy leveraging in-design analysis is needed to catch and resolve issues long before the implementation phase.
Unique AI-Driven Approach
Cadence Celsius Studio is the first thermal design and analysis solution to leverage AI technology, which replaces traditional point tools with a single, unified platform that enables both electrical and mechanical/thermal engineers to concurrently design and analyze without the need for geometry simplification, manipulation, and/or translation. The convergence of electrothermal co-simulation, electronic cooling, and thermal stress into a single cohesive offering is a completely new approach.
In-Design Analysis
In support of Cadence’s Intelligent System Design Strategy, our multiphysics design and analysis products have become part of a shift-left philosophy to drive multiphysics analysis from an afterthought in the workflow to an integral part of each phase of the design process—from the chip level all the way to complete system level. As part of Cadence’s in-design analysis suite of offerings, Celsius Studio empowers designers to perform multiphysics analysis early in the design cycle, thus discovering thermal integrity issues and optimizing them with AI technology to converge on ideal thermal designs. This streamlined workflow improves collaboration, reduces design iterations, and enables predictable design schedules, which in turn reduces turnaround ties and accelerates time to market.
Celsius Studio and Optimality Intelligent System Explorer
AI is reshaping the way we design and the benefits our customers can derive from our multiphysics analysis technologies. Cadence’s revolutionary AI product, Optimality Intelligent System Explorer was first integrated into our Clarity 3D EM Solver last year, and now it is also available for thermal analysis. Optimality AI-driven technology works with Celsius Studio’s in-design analysis capabilities to discover thermal integrity issues early and leverage generative AI optimization techniques to efficiently uncover ideal thermal designs without spending days, even weeks, manually deciding on the best fix.
ECAD and MCAD Co-Processing
Celsius Studio is a single platform for both electrical engineers (EEs) and mechanical engineers (MEs). For EEs, the Celsius Thermal Solver enables chip/SoC performance/thermal analysis, electrothermal co-simulation for packages and PCBs, and package/PCB thermal-aware component placement. For thermal engineers, Celsius Electronics Cooling has electronic cooling thermal analysis that mitigates potential thermal problems by adding heatsinks, fans, vents, etc.
Celsius Studio offers seamless integration of ECAD and MCAD design files with no simplification, resulting in streamlined workflows making in-design analysis efficient and fast. It also assimilates MCAD files quickly and efficiently using model abstraction hierarchy. The convergence of ECAD and MCAD results in design and analysis team synergy, enabling IDA and reducing design risks.
Additional Key Features and Benefits
The Celsius Studio platform includes several important features across both EDA and MCAD lifecycles. The software offers thermal-aware chip/CoC design, thermal-aware in-design for package analysis, and thermal-aware in-design for PCB analysis.
It also has electronics cooling analysis for system enclosures, AI-enabled analysis for design optimization, and warpage analysis for stress. These features help designers discover thermal issues in the early stages of the design, leverage AI for optimization and novel modeling algorithms, and deliver high-performing products up to 10X faster, leading to a strong return on investment.
Another unique technology within Celsius Studio is the combination of finite element method (FEM) with computational fluid dynamics (CFD), which enables fast, accurate, full-system thermal analysis with detailed granularity. It also enables multi-stage analysis for the assembly process and addresses 3C-IC warpage issues or multi-die stacks on a single package.
And, of course, because Celsius Studio is integrated with Cadence’s other powerful implementation platforms, including Virtuoso layout, Allegro PCB, Innovus implementation, and AWR microwave/RF, designers get a breadth of capabilities within one platform that can’t be matched by other thermal point tools.
Learn more about Celsius Studio today.