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Free Signal Integrity
What do we mean by free signal integrity? Be sure to attend our joint Wild River Technology/Cadence DesignCon 2025 technical session, where we will unveil how understanding anisotropic materials and...
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Exploring Themes in OrCAD X Capture
The dark theme turns many user interface elements of your application dark and reduces the amount of light emitted from screens. Given that we spend about one-third of our day in front of laptop...
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The Year That Was: PCB and Package Design Training, Blogs, and Videos in 2024
Happy New Year! As another year has started, it’s time to reflect on our top blogs, training sessions, and training highlights from the last year and recap the significant news that emerged. Over the...
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Engage, Learn, and Connect: Quiz Power in the Cadence Community Forum
Find out how much you know with the fun, interactive quizzes created by our expert application engineers! The Community Forum quizzes are an entertaining way to strengthen your knowledge, meet other...
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DesignCon 2025 Highlights and Papers on Demand
The Cadence MSA team had a GREAT DesignCon highlighting how Cadence can help you accelerate your PCB and advanced IC packaging design cycles with electromagnetic, electronic, and thermal system...
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Setting the Stage: The Power of a Well-Crafted Introduction in Community Forums
You never get a second chance to make a first impression. Your introduction conveys a lot of information to your readers. An introduction is meant to draw the reader into your perspective, spark their...
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Free Signal Integrity?
Cadence and Wild River Technology (WRT), a leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 224G, collaborated on a...
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Ascent: Training Insights: Learn Allegro X System Capture from the Experts
In today’s fast-paced electronics industry, efficiency and innovation are key to staying competitive. Allegro X System Capture is an intuitive, high-performance solution tailored for today’s design...
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Thermal Analysis of 3D Stacking and BEOL Technologies
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization...
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Multiphysics Analysis Portfolio Continues to Grow
Cadence's multiphysics system analysis (MSA) portfolio grew in both depth and breadth throughout 2024. Across electromagnetics (EM), signal and power integrity (SI/PI), thermal and electronics cooling,...
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Sigrity and Systems Analysis 2024.1 HF2 Release Now Available
The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 HF2 release is now available for download at Cadence Downloads. This blog contains important links for accessing this release and introduces...
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Efficient Automotive Electronic Component Design and Analysis
In the automotive industry, there is zero tolerance for field failures, as human safety is at stake. Given the rapid evolution of the electric vehicle (EV) and autonomous driving technologies, it is...
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System Analysis Knowledge Bytes - Optimizing LPDDR5X Performance with Sigrity X
This blog post explores the capabilities of Cadence Sigrity X Advanced SI in designing and simulating reliable and high-performance LPDDR5X systems. LPDDR5X is a critical component in modern computing...
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BoardSurfers: Training Insights: Advanced Design Verification with RAVEL
RAVEL, which stands for Relational Algebra Verification Expression Language, is designed for implementing system-in-package design rules. It builds on a relational view of the design data and is...
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UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration
3D heterogeneous integration (3DHI) technology creates high-performance systems by integrating different types of semiconductor chips or chiplets stacked vertically. Diverse functions such as...
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