Heterogeneous integration is changing system design and analysis. Simply following Moore’s Law is no longer the best technical and economical path forward. Technology breakthroughs in semiconductor packaging are key to transforming chips into heterogeneously integrated 3D systems. The convergence of systems and chips is leading to new workforce challenges and extremely complex design flows.
Learn more about the challenges of heterogeneous integration, how it compares to SoC and 3D packaging, and the future of this technology for the semiconductor industry through the B&S Aerospace and Design podcast. Listen as hosts Bryan Goldstein, president of Analog Devices Federal and Vice President Aerospace and Defense Group, and Sean Darcy, Infineon senior director of marketing, talk with Cadence IC packaging and cross-platform solutions product management group director John Park.
Related Resources
- Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
- Heterogeneous Integration (HI) vs System on Chip (SoC) – What’s the Difference?
- Heterogeneous Integration Co-Design Won’t Be Easy – Here’s What You Need to Succeed